-
1
-
-
24644488757
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Understanding and reduction of defects on finished EUV mask
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T. Liang, P. Sanchez, G. Zhang, E. Shu, R. Nagpal and A. Stivers, "Understanding and reduction of defects on finished EUV mask", Proc. SPIE Vol. 5752, 654 (2005).
-
(2005)
Proc. SPIE
, vol.5752
, pp. 654
-
-
Liang, T.1
Sanchez, P.2
Zhang, G.3
Shu, E.4
Nagpal, R.5
Stivers, A.6
-
2
-
-
11844306667
-
Ru capped EUVL ML mask blank performance
-
P. Yan, G. Zhang, E. Spiller and P. Mirkarimi, "Ru Capped EUVL ML mask blank performance", Proc. SPIE Vol. 5446, 824 (2004).
-
(2004)
Proc. SPIE
, vol.5446
, pp. 824
-
-
Yan, P.1
Zhang, G.2
Spiller, E.3
Mirkarimi, P.4
-
3
-
-
0001040077
-
Investigating the growth of localized defects in thin films using gold nanospheres
-
P. Mirkarimi and D. Steams, "Investigating the growth of localized defects in thin films using gold nanospheres", Appl. Phys. Lett. Vol. 77, 2243 (2000).
-
(2000)
Appl. Phys. Lett.
, vol.77
, pp. 2243
-
-
Mirkarimi, P.1
Steams, D.2
-
4
-
-
33744721049
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A Silicaon-based sequential coat-and-etch process to fabricate nearly perfect substrate surface
-
and references herein
-
P.B, Mirkarimi, E. Spiller, S.L. Baker, D.G. Stearns, J.C. Robinson, D.L. Olynick, F. Salmassi, J.A. Liddle, T. Liang and A.R. Stivers, "A Silicaon-based sequential coat-and-etch process to fabricate nearly perfect substrate surface", J. Nanosci. Nanotechnol., Vol. 6, 28 (2006) and references herein.
-
(2006)
J. Nanosci. Nanotechnol.
, vol.6
, pp. 28
-
-
Mirkarimi, P.B.1
Spiller, E.2
Baker, S.L.3
Stearns, D.G.4
Robinson, J.C.5
Olynick, D.L.6
Salmassi, F.7
Liddle, J.A.8
Liang, T.9
Stivers, A.R.10
-
5
-
-
0035765795
-
Enhanced optical inspectability of patterned EUVL mask
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T. Liang, A. Stivers, P. Van, E. Tejnil and G. Zhang, "Enhanced optical inspectability of patterned EUVL mask", Proc. SPIE Vol. 4562, 288(2002).
-
(2002)
Proc. SPIE
, vol.4562
, pp. 288
-
-
Liang, T.1
Stivers, A.2
Van, P.3
Tejnil, E.4
Zhang, G.5
-
6
-
-
29044442484
-
Characterization of the synchrotron-based 0.3 numerical aperture extreme ultraviolet microexposure tool at the Advanced Light Source
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P. Naulleau, et al, "Characterization of the synchrotron-based 0.3 numerical aperture extreme ultraviolet microexposure tool at the Advanced Light Source", J. Vac. Sci. Technol. B23(6), 2840 (2005).
-
(2005)
J. Vac. Sci. Technol.
, vol.B23
, Issue.6
, pp. 2840
-
-
Naulleau, P.1
-
7
-
-
33745619208
-
Investigation of the current resolution limit of advanced extreme ultraviolet resists
-
P. Naulleau, et al, "investigation of the current resolution limit of advanced extreme ultraviolet resists", Proc. SPIE Vol. 6151 (2006).
-
(2006)
Proc. SPIE
, vol.6151
-
-
Naulleau, P.1
-
10
-
-
0033723105
-
The mask error factor in optical lithography
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A.K. Wong, R. A. Ferguson and S.M. Mansfield, "The mask error factor in optical lithography", IEEE Trans. Semicond. manufact, Vol. 13(2), 235 (2000).
-
(2000)
IEEE Trans. Semicond. Manufact
, vol.13
, Issue.2
, pp. 235
-
-
Wong, A.K.1
Ferguson, R.A.2
Mansfield, S.M.3
-
11
-
-
3843141562
-
EUVL defect printability at the 32nm node
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E. Gullikson, E. Tejnil, T. Liang and A. Stivers, "EUVL defect printability at the 32nm node", Proc. SPIE Vol. 5374, 791(2004).
-
(2004)
Proc. SPIE
, vol.5374
, pp. 791
-
-
Gullikson, E.1
Tejnil, E.2
Liang, T.3
Stivers, A.4
-
12
-
-
0033683761
-
EUV mask contact layer defect printability and requirement
-
P. Yan, C. Lai and G. Cardinale, "EUV mask contact layer defect printability and requirement", Proc. SPIE Vol. 3997, 508 (2000).
-
(2000)
Proc. SPIE
, vol.3997
, pp. 508
-
-
Yan, P.1
Lai, C.2
Cardinale, G.3
-
13
-
-
85099527036
-
Mask industry assessment: 2005
-
G. Sheldon and S. Hector, "Mask industry assessment: 2005", Proc. SPIE Vol. 5992, 1 (2005).
-
(2005)
Proc. SPIE
, vol.5992
, pp. 1
-
-
Sheldon, G.1
Hector, S.2
-
14
-
-
0036378866
-
Damage-free mask repair using electron induced chemical reactions
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T. Liang and A. Stivers, "Damage-free mask repair using electron induced chemical reactions", Proc. SPIE Vol. 4688, 375 (2002).
-
(2002)
Proc. SPIE
, vol.4688
, pp. 375
-
-
Liang, T.1
Stivers, A.2
-
15
-
-
11844297846
-
Demonstration of damage-free mask repair using electron bean-induced proceses
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T. Liang, A. Stivers, M. Penn, D. Bald, C. Sethi, V. Boegli, M. Budach, K. Edinger and P. Spies, "Demonstration of damage-free mask repair using electron bean-induced proceses", Proc. SPEI VOl. 5446, 291(2004).
-
(2004)
Proc. SPEI
, vol.5446
, pp. 291
-
-
Liang, T.1
Stivers, A.2
Penn, M.3
Bald, D.4
Sethi, C.5
Boegli, V.6
Budach, M.7
Edinger, K.8
Spies, P.9
-
16
-
-
19844369720
-
E-beam mask repair: Fundamental capability and applications
-
T. Liang, E. Frendberg, D. Bald, M. Penn and A. Stivers, "E-beam mask repair: Fundamental capability and applications", Proc. SPIE Vol. 5567, 456(2004).
-
(2004)
Proc. SPIE
, vol.5567
, pp. 456
-
-
Liang, T.1
Frendberg, E.2
Bald, D.3
Penn, M.4
Stivers, A.5
-
17
-
-
29044450092
-
Advanced photolithographic mask repair using electron beams
-
and references herein
-
T. Liang, E. Frendberg, B. Lieberman and A. Stivers, "Advanced photolithographic mask repair using electron beams", J. Vac. Sci. Technol., B23(6), 3101(2005) and references herein.
-
(2005)
J. Vac. Sci. Technol.
, vol.B23
, Issue.6
, pp. 3101
-
-
Liang, T.1
Frendberg, E.2
Lieberman, B.3
Stivers, A.4
-
18
-
-
0034318137
-
Progress in extreme ultraviolet mask repair using a focused ion beam
-
T. Liang, A. Stivers, R. Livengood, P. Van, G. Zhang and F. Lo, "Progress in extreme ultraviolet mask repair using a focused ion beam", J. Vac. Sci. Techol., B 18(6), 3216(2000).
-
(2000)
J. Vac. Sci. Techol., B
, vol.18
, Issue.6
, pp. 3216
-
-
Liang, T.1
Stivers, A.2
Livengood, R.3
Van, P.4
Zhang, G.5
Lo, F.6
-
19
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-
84858933066
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-
2005 ITRS: http://www.itrs.net/Common/2005ITRS/Home2005.htm
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2005 ITRS
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