Understanding and reduction of defects on finished EUV masks

Progress in Biomedical Optics and Imaging - Proceedings of SPIE

Volumn 5752, Issue II, 2005, Pages 654-662

  Liang, Ted ^a   Sanchez, Peter ^a   Zhang, Guojing ^a   Shu, Emily ^a   Nagpal, Rajesh ^a   Stivers, Alan ^a  

^a INTEL CORPORATION   (United States)

Author keywords

AES; Defect characterization; Electron beam; EUV lithography; EUV masks; Mask inspection; Mask repair

Indexed keywords

INSPECTION TOOLS SENSITIVITY; PATTERN INSPECTION; PATTERN REPAIR; PHOTOMASKS;

ELECTRON BEAMS; LITHOGRAPHY; PATTERN RECOGNITION; ULTRAVIOLET RADIATION;

MASKS;

EID: 24644488757     PISSN: 16057422     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.604717     Document Type: Conference Paper

References (13)

1. E. Gullikson, E. Tejnil, T. Liang, A. Stivers, "EUVL Defect Printability at the 32 nm Node', Proc. SPIE, Vol. 5374, 791 (2004).
2. P. Mirkarimi, E. Spiller, S. Baker, V. Sperry, D. Stearns, E. Gullikson, "Developing a viable multilayer coating process for extreme ultraviolet lithography reticles", J. microlithor. Microfabrication, Microsyst, 3(1), 139 (2004).
3. A. Stivers, P. Yan, G. Zhang, T. Liang, E. Shu, E. Tejnil, B. Lieberman, R. Nagpal, K. Hsia, M. Penn and F. Lo, "EUV mask Pilot line at Intel Corporation", Proc. SPIE, Vol. 5567, 13 (2004).
4. A. Stivers, T. Liang, M. Penn, B. Lieberman, G. Shelden, J. Folta, C. Larson, P. Mirkarimi, C. Walton, E. Gullikson and M. Yi, "Evaluation of the Capability of a Multibeam Confocal Inspection System for Inspection of EUVL Mask Blanks," Proc. SPIE, Vol. 4889, 408 (2003).
5. J. Urbach, J. Cavelaars, H. Kusunose, T. Liang and A. Stivers, "EUV substrate and blank inspection with confocal microscopy", Proc. SPIE, Vol. 5256, 556 (2003).
6. T. Shoki, M. Hosoya, T. Kinoshita, H. Kobayashi, Y. Usui, R. Ohkubo, S. Ishibashi and O. Nagarekawa, "Process development of 6-inch EUV mask with TaBN absorber", Proc. SPIE, Vol. 4754, 857 (2002).
7. See for example: 1) T. Liang, A. Stivers, P, Yan, E. Tejnil and G. Zhang, "Enhanced Optical Inspectability of Patterned EUVL Mask," Proc. SPIE, Vol. 4562, 288 (2002);
8. D. Pettibone, A. Veldman, T. Liang, A. Stivers, P. Mangat, B. Lu, S. Hector, J. Wasson, K. Blaedel, E. Fisch, and D. Walker, "Inspection of EUV Reticles", Proc. SPIE, Vol. 4688, 363 (2002).
9. S. Munir, D. Bald, V. Tolani and F. Ghadiali, "DIVAS: An Integrated Networked System for Mask Defect Dispositioning and Defect Management", Proc. SPIE, Vol. 5043, 114 (2003).
10. T. Liang, A. Stivers, M. Penn, M. Penn, D. Bald, C. Sethi, V. Boegli, M. Budach, K. Edinger and P. Spies, "Demonstration of damage-free mask repair using electron bean-induced processes", Proc. SPIE, Vol. 5446, 291 (2004).
11. T. Liang, E. Frendberg, D. Bald, M. Penn and A. Stivers, "E-beam mask repair: Fundamental capability and applications", Proc. SPIE, Vol. 5567, 456 (2004).
12. E. Shu, "Sub-100nm defect classification and analysis on extreme ultraviolet (EUV) mask blanks and substrates", Photomask Japan (2005).
13. P. Kearney, R. Randive, A. Ma, D. Krick, A. Weaver, I. Reiss, D. Abraham, P. Mirkarimi, and E. Spiller, "Overcoming substrate defect decoration effects in EUVL mask blank development", Proc. SPIE, Vol. 5567, 800 (2004).