Shielded passive devices for silicon-based monolithic microwave and millimeter-wave integrated circuits

IEEE Journal of Solid-State Circuits

Volumn 41, Issue 5, 2006, Pages 1183-1200

  Cheung, Tak Shun Dickson ^a,b,c  

^a IEEE   (Canada)

^b UNIVERSITY OF TORONTO   (Canada)

^c DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

Bondpads; Coplanar transmission lines; Floating shield; Inductors; Millimeter wave integrated circuits; MMICs; On chip interconnects; Patterned ground shield; Silicon; Slow wave transmission lines; Substrate loss; Transformers

Indexed keywords

BONDPADS; COPLANAR TRANSMISSION LINES; FLOATING SHIELD; ON-CHIP INTERCONNECTS; PATTERNED GROUND SHIELD; SLOW-WAVE TRANSMISSION LINES; SUBSTRATE LOSS;

CMOS INTEGRATED CIRCUITS; ELECTRIC INDUCTORS; ELECTRIC TRANSFORMERS; ELECTROMAGNETIC SHIELDING; MICROSTRIP DEVICES; SILICON;

MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

EID: 33646440737     PISSN: 00189200     EISSN: None     Source Type: Journal    
DOI: 10.1109/JSSC.2006.872737     Document Type: Conference Paper

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