Bond-pad structure for reducing effects of substrate resistance on LNA performance in a silicon bipolar technology

Proceedings of the IEEE Bipolar/BiCMOS Circuits and Technology Meeting

Volumn , Issue , 1998, Pages 109-112

  Colvin, John T ^a   Bhatia, Saket S ^a   O, Kenneth K ^a  

^a UNIVERSITY OF FLORIDA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BIPOLAR TRANSISTORS; ELECTRIC RESISTANCE; SEMICONDUCTING SILICON; SPURIOUS SIGNAL NOISE; SUBSTRATES;

LOW NOISE AMPLIFIERS (LNA);

AMPLIFIERS (ELECTRONIC);

EID: 0032307874     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)