Wafer-level packaging technology for extended global wiring and inductors

European Solid-State Device Research Conference

Volumn , Issue , 2003, Pages 103-106

  Carchon, G ^a   Carbonell, L ^a   Jenei, S ^a,b   Van Hove, M ^a   Decoutere, S ^a   De Raedt, W ^a   Maex, K ^a,b   Beyne, E ^a  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

GLOBAL WIRING; WAFER-LEVEL PACKAGING TECHNOLOGY;

EID: 33646458057     PISSN: 19308876     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESSDERC.2003.1256821     Document Type: Conference Paper

References (6)

1. G. Carchon, et al., "Multilayer Thin-Film MCM-D for the Integration of High-Performance RF and Microwave Circuits," IEEE Transactions on Components and Packaging Technologies, vol. 24, pp. 510-519, 2001.
2. G. Carchon, et al., "Multi-layer thin film MCM-D for the integration of high-performance wireless front-end systems," Microwave Journal, vol. 44, pp. 96-110, 2001.
3. G. Carchon and. W. De Raedt, "Chapter 10: Integrated Inductors," in Integrated Passive Component Technology, L. Schaper and R. Ulrich, IEEE Press, 2003.
4. R. Groves, et al., "High Q inductors in a SiGe BiCMOS process utilizing a thick metal process add-on module," IEEE BCTM, Minneapolis, MN, pp. 149-152, Sept, 26-28, 1999.
5. S. Jenei, et al., "High Q add-on module in thick Cu/SILK single damascene," IITC, Burlingame, CA, pp. 107-109, June, 2-4, 2001.
6. C. P. Yue and S. S. Wong, "On-chip spiral inductors with patterned ground shields for Si-based RF IC's," Symposium on VLSI circuits, Kyoto, Japan, pp. 85-86, June, 12-14, 1997.