Characteristics of interconnect lines with patterned ground shields and its implication for microwave ICs

ICVC 1999 - 6th International Conference on VLSI and CAD

Volumn , Issue , 1999, Pages 444-447

  Lee, Sang Gug ^a   Gwak, Hyuk Yong ^a   Lowther, R ^b  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b INTERSIL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 29044446478     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICVC.1999.820959     Document Type: Conference Paper

References (3)

1. R. Lowther, "Integrated Circuit with an Improved Inductor Structure and Method of Fabrication," U.S. Patent #5717,243; Filed Feb. 10,1998.
2. C. R Yue and S. S. Wong, "On-Chip Spiral Inductors with Patterned Ground Shields for Si based RF IC's," IEEE Journal of Solid-State Circuits, vol. 33, no. 5, May 1998.
3. Y. Eo and W. R. Eisenstadt, "S-parameter-based IC Interconnect Transmission Line Characterization," BEEE Trans. Comp. Hybrids, Manuf. Technol., vol. 15, no. 5, Aug. 1992.