Long time reliability study of soldered flip chips on flexible substrates

Microelectronics Reliability

Volumn 44, Issue 2, 2004, Pages 309-314

  Pahl, Barbara ^a,b   Kallmayer, Christine ^a   Aschenbrenner, Rolf ^b   Reichl, Herbert ^b  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

^b FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; ATMOSPHERIC HUMIDITY; DEGRADATION; ELECTRIC RESISTANCE; ELECTRIC VARIABLES MEASUREMENT; ELECTRONIC EQUIPMENT; PACEMAKERS; PACKAGING; SOLDERING ALLOYS; SUBSTRATES; THERMAL CYCLING; THERMAL EFFECTS;

DAISY CHAIN (DC); ELECTRONIC PACKAGES; SCANNING ACOUSTIC MICROSCOPY (SAM); STENCIL PRINTING METHOD; THERMAL AGEING;

FLIP CHIP DEVICES;

EID: 0942287637     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2003.10.006     Document Type: Article

References (4)

1. Hung S.C. Board level reliability of PBGA using flexible substrates. Microelectron. Reliab. 41(5):2001;677-687.
2. Elenius P. Recent advantages in flip chip wafer bumping using solder paste technology. In: 49th ECTC, San Diego, USA, 1999.
3. Kallmayer Ch. Chip interconnection technologies on flexible circuits. In: Proceedings of IMAPS Flip Chip Workshop, Braselton, USA, March 2000.
4. Kloeser J, Jung E, Heinricht K, et al. Reliability investigations of Sn/Pb and lead free solders for flip chip technology. In: Proceedings of Pan Pacific Microelectronics Symposium and Tabletop Exhibition, Mauna Lani, USA, February 10-13, 1998.