No-flow underfill flip chip assembly - An experimental and modeling analysis

Microelectronics Reliability

Volumn 42, Issue 8, 2002, Pages 1205-1212

  Lu, H ^a   Hung, K C ^b   Stoyanov, S ^a   Bailey, C ^a   Chan, Y C ^b  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CURING; DELAMINATION; FATIGUE OF MATERIALS; INTERFACES (MATERIALS); MICROELECTRONIC PROCESSING; SOLDERED JOINTS; X RAY MICROSCOPES;

SCANNING ACOUSTIC MICROSCOPES;

FLIP CHIP DEVICES;

EID: 0036681880     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(02)00092-6     Document Type: Article

References (8)

1. High performance low cost underfills for flip chip applications
2. Study on the correlation of flip chip reliability with mechanical properties of no flow underfill materials
3. Incorporation of inorganic filler into the no-flow underfill material for flip chip application
4. Reliability of the microBGA assembly using no-flow underfill
5. Reliability analysis of flip chip designs via computer simulation
6. A parametric study of flip chip reliability based on solder fatigue modeling
7. Reliability of PBGA assembly