Effect of electromigration on mechanical behavior of solder joints

Materials Research Society Symposium Proceedings

Volumn 863, Issue , 2005, Pages 369-373

  Ren, Fei ^a   Nah, Jae Woong ^a   Gan, Hua ^a   Suh, Jong Ook ^a   Tu, King Ning ^a   Xiong, Bingshou ^b   Xu, Luhua ^b   Pang, John ^b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CATHODES; CURRENT DENSITY; ELECTROMIGRATION; INTERMETALLICS; TENSILE STRENGTH;

CATHODES INTERFACE;

SOLDERED JOINTS;

EID: 28844443558     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-863-b10.2     Document Type: Conference Paper

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