Wafer level hermetic package and device testing of a SOI-MEMS switch for biomedical applications

Journal of Micromechanics and Microengineering

Volumn 16, Issue 4, 2006, Pages 676-683

  Receveur, Rogier A M ^a   Zickar, Michael ^b   Marxer, Cornel ^b   Larik, Vincent ^a   De Rooij, Nicolaas F ^b  

^a MEDTRONIC BAKKEN RESEARCH CENTER   (Netherlands)

^b UNIVERSITY OF NEUCHÂTEL   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

BIOMEDICAL ENGINEERING; GOLD; HERMETIC DEVICES; NITROGEN; RUTHENIUM; SHEAR STRENGTH; SILICON; THERMAL CYCLING; WSI CIRCUITS;

BI-STABLE SOI-MEMS DC SWITCH; MICROCONTACT RELIABILITY MEASUREMENTS; MIL-STD-833;

ELECTROMECHANICAL DEVICES;

EID: 33645074923     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/16/4/002     Document Type: Article

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