A mold and transfer technique for lead-free fluxless soldering and application to wafer-level low-temperature thin-film packages

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2004, Pages 13-16

  Stark, Brian H ^a,b   Najafi, Khalil ^a,b  

^a UNIVERSITY OF MICHIGAN   (United States)

^b SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

LOW-TEMPERATURE THIN-FILM PACKAGES; PIRANI GAUGES; SOLDER BALLS; WET LITHOGRAPHY;

ELECTRONICS INDUSTRY; ERROR ANALYSIS; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; MOLDING; REACTIVE ION ETCHING; SILICON WAFERS; SOLDERING; THERMAL CYCLING; THIN FILMS;

ELECTRONICS PACKAGING;

EID: 3042780176     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

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