Evaluation of mechanical quality of field-assisted diffusion bonding by ultrasonic nondestructive method

Sensors and Actuators, A: Physical

Volumn 118, Issue 1, 2005, Pages 44-48

  Cao, Zongjie ^a   Chen, Huaidong ^a   Xue, Jin ^a   Wang, Yuwen ^a  

^a XI'AN JIAOTONG UNIVERSITY   (China)

Author keywords

Bonding ratio; Field assisted diffusion bonding; Mechanical quality; Ultrasonic nondestructive testing

Indexed keywords

BONDING; DATA REDUCTION; ELECTRIC POTENTIAL; FRACTURE TOUGHNESS; STRENGTH OF MATERIALS; TENSILE TESTING; THERMAL DIFFUSION; ULTRASONIC TESTING;

BONDING RATIO; FIELD-ASSISTED DIFFUSION BONDING; MECHANICAL QUALITY; ULTRASONIC NONDESTRUCTIVE TESTING;

NONDESTRUCTIVE EXAMINATION;

EID: 9944252324     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(04)00487-X     Document Type: Article

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