Vacuum wafer-level packaging for MEMS applications

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4979, Issue , 2003, Pages 271-278

  Caplet, Stéphane ^a   Sillon, Nicolas ^a   Delaye, Marie Thérèse ^a   Berruyer, Pascale ^a  

^a CEA LETI   (France)

Author keywords

Getter; MEMS; Outgassing; Vacuum packaging; Wafer bonding

Indexed keywords

DEGASSING; ENCAPSULATION; GETTERS; MICROELECTROMECHANICAL DEVICES; MICROPROCESSOR CHIPS; POLISHING; SILICON ON INSULATOR TECHNOLOGY; SILICON WAFERS; SOLDERING; VACUUM APPLICATIONS;

HERMETIC BONDING; VACUUM WAFER LEVEL PACKAGING; WAFER BONDING;

ELECTRONICS PACKAGING;

EID: 0042063595     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.478249     Document Type: Conference Paper

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