Electroless copper on refractory and noble metal substrates with an ultra-thin plasma-assisted atomic layer deposited palladium layer

Electrochimica Acta

Volumn 51, Issue 12, 2006, Pages 2400-2406

  Kim, Young Soon ^a   Kim, Hyung Il ^a   Cho, Joong Hee ^a   Seo, Hyung Kee ^a   Dar, M A ^a   Shin, Hyung Shik ^a   Ten Eyck, Gregory A ^b   Lu, Toh Ming ^b   Senkevich, Jay J ^c  

^a Chonbuk National University   (South Korea)

^b RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^c BREWER SCIENCE INC   (United States)

Author keywords

Copper electroless deposition; Diffusion barrier; RBS; XPS

Indexed keywords

CARBOXYLIC ACIDS; METALLIZING; POLYETHYLENE GLYCOLS; REFRACTORY METALS; SUBSTRATES; SURFACE ACTIVE AGENTS;

COPPER ELECTROLESS DEPOSITION; DIFFUSION BARRIER; RBS;

PALLADIUM;

EID: 32644485483     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2005.07.018     Document Type: Article

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