Inductively coupled hydrogen plasma-assisted Cu ALD on metallic and dielectric surfaces

Journal of the Electrochemical Society

Volumn 152, Issue 2, 2005, Pages

  Jezewski, Christopher ^a,b   Lanford, W A ^b   Wiegand, Christopher J ^a   Singh, J P ^a   Wang, Pei I ^a   Senkevich, Jay J ^a   Lu, Toh Ming ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^b STATE UNIVERSITY OF NEW YORK   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION; CURVE FITTING; DIELECTRIC MATERIALS; GROWTH (MATERIALS); INDUCTIVELY COUPLED PLASMA; PLASMAS; RUTHERFORD BACKSCATTERING SPECTROSCOPY; SATURATION (MATERIALS COMPOSITION); SURFACES; THERMAL EFFECTS;

ATOMIC LAYER DEPOSITION (ALD); DIELECTRIC SURFACES; HYDROGEN PLASMA; NONSELECTIVE DEPOSITION;

PULSED LASER DEPOSITION;

EID: 14744268671     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1850340     Document Type: Article

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