Forced convection magnetoelectroplating for enhanced semiconductor metallization

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 22, Issue 3, 2004, Pages 452-460

  Said, R A ^a  

^a UNITED ARAB EMIRATES UNIVERSITY   (United Arab Emirates)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; CAPACITANCE; COPPER; ELECTRODEPOSITION; ELECTROLYSIS; ELECTROLYTES; ELECTROPLATING; INTEGRATED CIRCUITS; LARGE SCALE SYSTEMS; MAGNETIC FIELDS; METALLIZING; PERMITTIVITY; SKIN EFFECT;

FLOW VELOCITY; LORENTZIAN FORCES; MAGNETOELECTROPLATING; POWER DISSIPATION;

SEMICONDUCTOR MATERIALS;

EID: 3142512685     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1666881     Document Type: Article

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