-
1
-
-
84886447961
-
CMOS devices below O.1μm: How high will performance go?
-
Y. Taur et al., "CMOS devices below O.1μm: How high will performance go?", lEDMTech. Dig., 1997, pp. 215-218.
-
(1997)
IEDM Tech. Dig.
, pp. 215-218
-
-
Taur, Y.1
-
2
-
-
0031140867
-
Quantum-mechanical modeling of electron tunneling current from the inversion layer of ultrathin-oxide nMOSFETs
-
Apr.
-
S.H. Lo et al., "Quantum-mechanical modeling of electron tunneling current from the inversion layer of ultrathin-oxide nMOSFETs", IEEE Electron Device Letts., Vol. 18, Apr. 1997, pp. 209-211.
-
(1997)
IEEE Electron Device Letts.
, vol.18
, pp. 209-211
-
-
Lo, S.H.1
-
3
-
-
0032275853
-
Reliability projection for ultrathin oxides at low voltage
-
J.H. Stathis et al., "Reliability projection for ultrathin oxides at low voltage", IEDM Tech. Dig., 1998, pp. 167-170.
-
(1998)
IEDM Tech. Dig.
, pp. 167-170
-
-
Stathis, J.H.1
-
4
-
-
0035872897
-
High-K gate dielectrics: Current status and materials properties considerations
-
G.D. Wilk et al., "High-K gate dielectrics: Current status and materials properties considerations", J. Appl. Phys., Vol. 89 (10), 2001, pp. 5243-5275.
-
(2001)
J. Appl. Phys.
, vol.89
, Issue.10
, pp. 5243-5275
-
-
Wilk, G.D.1
-
5
-
-
0034453464
-
2 high-k dielectrics
-
2 high-k dielectrics", IEDM Tech. Dig., 2000, pp. 35-38.
-
(2000)
IEDM Tech. Dig.
, pp. 35-38
-
-
Kang, L.1
-
8
-
-
18644367764
-
2 gate dielectrics
-
Oct.
-
2 gate dielectrics", IEEE Electron Device Letts., Vol. 23, Oct. 2002, pp. 594-596.
-
(2002)
IEEE Electron Device Letts.
, vol.23
, pp. 594-596
-
-
Kim, Y.H.1
-
10
-
-
0036540855
-
Low weibull slope of breakdown distributions in high-K layers
-
Apr.
-
T. Kauerauf et al., "Low Weibull Slope of Breakdown Distributions in High-k Layers", IEEE Electron Device Letts. Vol. 23, Apr. 2002, pp. 215-217.
-
(2002)
IEEE Electron Device Letts.
, vol.23
, pp. 215-217
-
-
Kauerauf, T.1
-
11
-
-
31144473439
-
Gate dielectric degradation mechanism associated with DBIE evolution
-
to be presented
-
K.L Pey et al., "Gate dielectric degradation mechanism associated with DBIE evolution", to be presented in IEEE Proc. IRPS, 2004.
-
(2004)
IEEE Proc. IRPS
-
-
Pey, K.L.1
-
12
-
-
0036712468
-
Polarity dependent dielectric-breakdown induced-epitaxy in Si MOSFETs
-
Sept.
-
C.H. Tung et al., "Polarity dependent dielectric-breakdown induced-epitaxy in Si MOSFETs", IEEE Electron Device Letts., Vol. 23, Sept. 2002, pp. 526-528.
-
(2002)
IEEE Electron Device Letts.
, vol.23
, pp. 526-528
-
-
Tung, C.H.1
-
13
-
-
85070030498
-
Dielectric breakdown induced epitaxy in ultrathin gate oxide - A reliability concern
-
K.L. Pey et al., "Dielectric breakdown induced epitaxy in ultrathin gate oxide - a reliability concern", IEDM Tech. Dig., 2002. pp. 166-169.
-
(2002)
IEDM Tech. Dig.
, pp. 166-169
-
-
Pey, K.L.1
-
14
-
-
0142058338
-
Percolation path and dielectric- breakdown-induced-epitaxy in narrow n- and p-metal oxide semiconductor field effect transistor
-
Sept.
-
C.H. Tung et al., "Percolation path and dielectric- breakdown-induced-epitaxy in narrow n- and p-metal oxide semiconductor field effect transistor", Appl. Phys. Letts., Vol. 83 (11), Sept. 2003. pp. 2223-2225.
-
(2003)
Appl. Phys. Letts.
, vol.83
, Issue.11
, pp. 2223-2225
-
-
Tung, C.H.1
-
15
-
-
0142198439
-
Size difference in dielectric-breakdown-induced epitaxy in narrow n- and p-metal oxide semiconductor field effect transistors
-
Oct.
-
K.L. Pey et al., "Size difference in dielectric-breakdown-induced epitaxy in narrow n- and p-metal oxide semiconductor field effect transistors". Appl. Phys. Letts., Vol. 83 (14), Oct. 2003, pp. 2940-2942.
-
(2003)
Appl. Phys. Letts.
, vol.83
, Issue.14
, pp. 2940-2942
-
-
Pey, K.L.1
-
16
-
-
0142163573
-
Physical analysis of Ti-migration in 33 A gate oxide breakdown
-
K.L. Pey et al. "Physical analysis of Ti-migration in 33 A gate oxide breakdown", IEEE Proc. IRPS, 2002, pp. 210-215.
-
(2002)
IEEE Proc. IRPS
, pp. 210-215
-
-
Pey, K.L.1
-
17
-
-
3042653978
-
Gate dielectric breakdown induced microstructural damage in MOSFETs
-
to be published, Mar. Issue
-
L.J. Tang et al., "Gate dielectric breakdown induced microstructural damage in MOSFETs", to be published in IEEE TDMR, Mar. 2004 Issue.
-
(2004)
IEEE TDMR
-
-
Tang, L.J.1
-
18
-
-
59949096250
-
Relation between breakdown mode and breakdown location in short channel NMOSFETs and its impact on reliability specifications
-
R. Degraeve et al., "Relation between breakdown mode and breakdown location in short channel NMOSFETs and its impact on reliability specifications", IEEE Proc. IRPS, 2001. pp. 360-366.
-
(2001)
IEEE Proc. IRPS
, pp. 360-366
-
-
Degraeve, R.1
-
19
-
-
0042694471
-
Correlation of failure mechanism of constant-current-stress and constant - Voltage stress breakdowns in ultrathin gate oxides of nMOSFETs using TEM
-
K.L. Pey et al., "Correlation of failure mechanism of constant-current-stress and constant - voltage stress breakdowns in ultrathin gate oxides of nMOSFETs using TEM", Microelectronics Reliability, Vol. 43, 2003, pp. 1471-1476.
-
(2003)
Microelectronics Reliability
, vol.43
, pp. 1471-1476
-
-
Pey, K.L.1
-
20
-
-
0036539453
-
Physical analysis of hard and soft breakdown failures in ultrathin gate oxides
-
M.K. Radhakrishnan et al., "Physical analysis of hard and soft breakdown failures in ultrathin gate oxides". Microelectronics Reliability, Vol. 42, 2002, pp. 565-571.
-
(2002)
Microelectronics Reliability
, vol.42
, pp. 565-571
-
-
Radhakrishnan, M.K.1
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