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Volumn 5375, Issue PART 1, 2004, Pages 51-65

A new approach to pattern metrology

Author keywords

Critical dimension; Etch; Film thickness; Integrated metrology; Lithography; Overlay; Process control

Indexed keywords

ATOMIC FORCE MICROSCOPY; CALIBRATION; ERROR ANALYSIS; ETCHING; LITHOGRAPHY; OPTICAL MICROSCOPY; PROCESS CONTROL; SCANNING ELECTRON MICROSCOPY; SCATTERING; SIGNAL TO NOISE RATIO; THICKNESS MEASUREMENT;

EID: 2942648265     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.539143     Document Type: Conference Paper
Times cited : (18)

References (14)
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  • 4
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    • Scatterometry-based overlay metrology
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  • 5
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    • A novel diffraction based spectroscopic method for overlay metrology
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  • 6
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  • 9
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.