Silicon-to-steel bonding using rapid thermal annealing

IEEE Transactions on Advanced Packaging

Volumn 28, Issue 4, 2005, Pages 626-634

  Sosnowchik, Brian D ^a   Azevedo, Robert G ^a   Cao, Andrew ^a,b   Lin, Liwei ^a   Pisano, Albert P ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b Cypress Semiconductors   (United States)

Author keywords

Eutectic Pb Sn; Silicon bonding and packaging; Steel bonding

Indexed keywords

ADHESION; BONDING; COMPRESSION TESTING; CORROSION RESISTANCE; LOW TEMPERATURE OPERATIONS; MICROELECTROMECHANICAL DEVICES; MICROSENSORS; RAPID THERMAL ANNEALING; SEMICONDUCTING SILICON; STEEL; TENSILE TESTING; THIN FILMS;

LOW-TEMPERATURE BONDING; SILICON-TO-STEEL BONDING; THIN-FILM ADHESION LAYER SYSTEMS;

ELECTRONICS PACKAGING;

EID: 28444448772     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2005.858307     Document Type: Article

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