Processing and characterization of diffusion-bonded Al-Si interfaces

Journal of Materials Processing Technology

Volumn 145, Issue 1, 2004, Pages 99-108

  Peterson, K A ^a   Dutta, I ^a   Chen, M ^b  

^a Naval Postgraduate School ^*  (United States)

^b Johns Hopkins University   (United States)

Author keywords

Aluminum; Characterization; Diffusion bonding; Interface; Silicon

Indexed keywords

AMORPHOUS MATERIALS; BONDING; DIES; DIFFUSION; INTERFACES (MATERIALS); MORPHOLOGY; OPTICAL MICROSCOPY; PLASTIC DEFORMATION; RECRYSTALLIZATION (METALLURGY); SCANNING ELECTRON MICROSCOPY; SILICON; TEXTURES; TRANSMISSION ELECTRON MICROSCOPY;

DIFFUSION BONDING; MATERIAL SELECTION;

ALUMINUM;

EID: 0347354865     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-0136(03)00877-X     Document Type: Article

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