Rapid low temperature bonding of silicon to steel for MEMS sensors

American Society of Mechanical Engineers, Micro-Electro Mechanical Systems Division, (Publications) MEMS

Volumn , Issue , 2004, Pages 5-11

  Cao, Andrew ^a   Lin, Liwei ^a   Sosnowchik, Brian ^a   Pisano, Albert ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CORROSION RESISTANCE; DELAMINATION; ELECTROPLATING; LOW TEMPERATURE EFFECTS; MICROSENSORS; SILICON; STEEL; STRAIN;

BONDING METHODS; CYCLIC STRAINS; STATIC LOADING; STRAIN SENSORS;

MICROELECTROMECHANICAL DEVICES;

EID: 21644440657     PISSN: 1096665X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2004-60683     Document Type: Conference Paper

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15. th International Conference on Solid-State Sensors and Actuators
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