Effect of crystal orientation on fracture strength and fracture toughness of single crystal silicon

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2004, Pages 177-180

  Ando, Taeko ^a   Li, Xueping ^a   Nakao, Shigeki ^a   Kasai, Takashi ^a   Shikida, Mitsuhiro ^a   Sato, Kazuo ^a  

^a NAGOYA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CLEAVAGE PLANES; ON-CHIP TENSILE TESTING; SPECIMENS;

CRACK PROPAGATION; CRYSTAL ORIENTATION; CRYSTALLOGRAPHY; FRACTURE TOUGHNESS; LOADS (FORCES); SINGLE CRYSTALS; STRENGTH OF MATERIALS; TENSILE TESTING;

SILICON;

EID: 3042697043     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2003.1189715     Document Type: Conference Paper

References (6)

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2. T. Yi, L. Li, and C. -J. Kim, "Microscale material testing of single crystalline silicon process effects on surface morphology and tensile strength", Sensors and Actuators, A83, 2000, pp. 172-178.
3. T. Namazu, Y. Isono, and T. Tanaka, "Evaluation of size effect on mechanical properties of single crystal silicon by nanoscale bending test using AFM", J. MEMS, vol. 9, no. 4, 2000, pp. 450-459.
4. F. Ebrahimi and L. Kalwani, "Fracture anisotropy in silicon single crystal", Mater. Sci. Eng., A 268, 1999, pp. 116-126.
5. A. M. Fitzgerald, R. H. Dauskardt, and T. W. Kenny, "Fracture toughness and crack growth phenomena of plasma-etched single crystal silicon", Sensors and Actuators, A 83, 2000, pp. 194-199.
6. X. Li, T. Kasai, S. Nakao, H. Tanaka, T. Ando, M. Shikida, and K. Sato, "A Method for measuring the fracture toughness of micrometer-sized single crystal silicon by tensile test", Digest Tech. Papers Transducers'03 Conference, Boston, June 812, 2003, pp. 444-447.