Interfacial reactions and compound formation in the edge of PbSn flip-chip solder bumps on Ni/Cu under-bump metallization

Journal of Electronic Materials

Volumn 32, Issue 11, 2003, Pages 1273-1277

  Huang, Chien Sheng ^a   Jang, Guh Yaw ^a   Duh, Jenq Gong ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Flip chip; High temperature storage; Intermetallic compound; Reflow; Under bump metallization

Indexed keywords

COPPER; ELECTRONICS PACKAGING; EUTECTICS; INTERFACES (MATERIALS); INTERMETALLICS; LEAD ALLOYS; METALLIZING; NICKEL; SEMICONDUCTOR GROWTH; SOLDERING ALLOYS;

BALL GRID ARRAY; HIGH TEMPERATURE STORAGE; TIN LEAD SOLDER; UNDER BUMP METALLIZATION;

FLIP CHIP DEVICES;

EID: 0346846604     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0022-5     Document Type: Article

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