Thermosonic flip-chip bonding using longitudinal ultrasonic vibration

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 21, Issue 1, 1998, Pages 53-57

  Tan, Qing ^b   Zhang, Wenge ^b   Schaible, Brian ^b   Bond, Leonard J ^a,b   Ju, Teh Hua ^b   Lee, Yung Cheng ^b  

^a IEEE

^b UNIVERSITY OF COLORADO   (United States)

Author keywords

Finite element analysis; First level electronic packaging; Impact; Longitudinal vibration; Prototyping; Thermosonic flip chip bonding; Ultrasonic

Indexed keywords

ASSEMBLY; CMOS INTEGRATED CIRCUITS; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; RANDOM ACCESS STORAGE; SOLDERING; ULTRASONIC WAVES; VIBRATIONS (MECHANICAL);

STATIC RANDOM ACCESS MEMORY (SRAM); THERMOSONIC FLIP CHIP BONDING; ULTRASONIC VIBRATIONS;

FLIP CHIP DEVICES;

EID: 0031999974     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.659506     Document Type: Article

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