Dynamic compact thermal models with multiple power sources: Application to an ultrathin chip stacking technology

IEEE Transactions on Advanced Packaging

Volumn 28, Issue 4, 2005, Pages 694-703

  Palacín, Jordi ^a,b   Salleras, Marc ^b   Samitier, Josep ^b   Marco, Santiago ^b  

^a UNIVERSITY OF LLEIDA   (Spain)

^b UNIVERSITY OF BARCELONA   (Spain)

Author keywords

Dynamic compact thermal models; Modeling; Thin electronics

Indexed keywords

CHIP SCALE PACKAGES; COMPUTER SIMULATION; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; MATRIX ALGEBRA; TEMPERATURE DISTRIBUTION; TRANSFER FUNCTIONS;

DYNAMIC COMPACT THERMAL MODELS; NONLINEAR LEAST SQUARES (NLSQ) METHODS; ULTRATHIN CHIP STACKING TECHNOLOGY (UTCS);

MULTICHIP MODULES;

EID: 28444437753     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2005.850507     Document Type: Article

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