Residual thermomechanical stresses in thinned-chip assemblies

IEEE Transactions on Components and Packaging Technologies

Volumn 23, Issue 4, 2000, Pages 673-683

  Leseduarte, Sergio ^a   Marco, Santiago ^a   Beyne, Eric ^b   Van Hoof, Rita ^b   Marty, Antoine ^c   Pinel, Stéphane ^c   Vendier, Olivier ^d   Coello Vera, Augustín ^d  

^a UNIVERSITY OF BARCELONA   (Spain)

^b IMEC   (Belgium)

^c LAAS CNRS   (France)

^d THALES ALENIA SPACE   (France)

Author keywords

3 D integration; BCB; Copper; Creep; Finite element simulation; Interconnects; MCM; Process modeling; Thermomechanical stresses

Indexed keywords

COMPUTER SIMULATION; COPPER; CREEP; DELAMINATION; DIELECTRIC MATERIALS; FINITE ELEMENT METHOD; INTEGRATED CIRCUIT LAYOUT; INTERCONNECTION NETWORKS; MULTICHIP MODULES; RESIDUAL STRESSES; SEMICONDUCTING SILICON;

BENZOCYCLOBUTENE; PROCESS MODELING; THERMOMECHANICAL STRESSES; THINNED CHIP ASSEMBLIES; THREE DIMENSIONAL INTEGRATION; ULTRATHIN CHIP STACKING;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0034482866     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.888852     Document Type: Article

References (14)

1. P. Chahal, R. Tummala, and M. G. Allen, "Integrated capacitors using polymer-ceramic composite for MCM-L," in Proc. Int. Symp. Microeletron., Orlando, FL, May 28-31, 1996, pp. 126-131.
2. D. K. Dasgupta and K. Doughty, "Polymer-ceramic composite materials with high dielectric constants," Thin Solid Films, vol. 158, pp. 93-105, 1988.
3. S. Ogitani, S. A. Bidstrup-Allen, and P. Kohl, "High dielectric material for embedded capacitor application," in Proc. IPC Conf., San Diego, CA, Apr. 2-6, 2000.
4. _, "Embedded capacitor manufacture based on thin-film process," in Proc. 23rd Int. Electron. Manufact. Technol. Symp., 1998, pp. 199-205.
5. D. Sinha and P. K. C. Pillai, "Polymer-ceramic composites as potential capacitor material," J. Mater. Sci. Lett., vol. 8, pp. 673-674, 1989.
6. H. S. Nalwa, Chemist Physics, and Application. Beijing, China: M. Dedder Corp., 1989, ch. 11.
7. 3 composite films," J. Appl. Phys., vol. 55, pp. 3382-3410, 1984.
8. H. C. van de Hulst, Light Scattering by Small Particles. New York: Dover, 1969.
9. M. Kerker, The Scattering of Light and Other Electromagnetic Radiation. New York: Academic, 1969.
10. D. Stauffer and A. Aharony, Introduction to Percolation Theory. Washington, DC: Taylor & Francis, 1991.
11. M. Sahimi, Application of Percolation Theory. Washington, DC: Taylor & Francis, 1994.
12. B. Sareni, L. Krahenbuhl, and A. Beroual, "Effective dielectric constant of random composite materials," J. Appl. Phys., vol. 85, pp. 2375-2383, 1997.
13. A. Priou, Ed., Progress in Electromagnatics Research: Dielectric Properties of Heterogeneous Materials. New York: Elsevier, 1992.
14. G. W. Milton, "Bounds on the complex permittivity of a two-component composite material," J. Appl. Phys., vol. 52, pp. 5286-5293, 1981.