Ultra thin electronics for space applications

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 767-771

  Vendier, O ^a   Huan, M ^a   Drevon, C ^a   Cazaux, J L ^a   Beyne, E ^b   Van Hoof, R ^b   Marty, A ^c   Pinel, S ^c   Tasselli, J ^c   Marco, S ^d   Morante, J R ^d  

^a THALES ALENIA SPACE   (France)

^b IMEC   (Belgium)

^c LAAS CNRS   (France)

^d UNIVERSITY OF BARCELONA   (Spain)

Author keywords

[No Author keywords available]

Indexed keywords

APPLICATION SPECIFIC INTEGRATED CIRCUITS; ELECTRONICS INDUSTRY; INTEGRATED CIRCUIT MANUFACTURE; MATHEMATICAL MODELS; MICROWAVE INTEGRATED CIRCUITS; SURFACE MOUNT TECHNOLOGY; THREE DIMENSIONAL;

PATENTED PACKAGING TECHNOLOGY; ULTRA COMPACT CHANNELIZER; ULTRATHIN ELECTRONICS;

CHIP SCALE PACKAGES;

EID: 0034822277     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: 10.1109/ECTC.2001.927865     Document Type: Article

References (6)

1. Thin semiconductor film bonding technology for high density 3D stacking
2. Ultra thin electronic device package
3. A new ultra-thin 3D integration technique: Technological and thermal aspects
4. Residual thermo-mechanical stresses in thinned-chip assemblies
5. Thermal modeling and management in ultra-thin chip stack technology