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Volumn , Issue , 2000, Pages 227-234
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Thermal RC-network approach to analyze multichip power packages
a
a
Motorola GmbH
(Germany)
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Author keywords
[No Author keywords available]
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Indexed keywords
COMPUTER SIMULATION;
HEAT RESISTANCE;
HEAT TRANSFER;
INTERCONNECTION NETWORKS;
LAPLACE TRANSFORMS;
MULTICHIP POWER PACKAGES;
ELECTRONICS PACKAGING;
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EID: 0033741467
PISSN: 10652221
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Article |
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Times cited : (15)
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References (6)
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