Top-down meets bottom-up: Dip-pen nanolithography and DNA-directed assembly of nanoscale electrical circuits

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Volumn 1, Issue 1, 2005, Pages 64-69

  Chung, Sung Wook ^a   Ginger, David S ^a,b   Morales, Mark W ^a   Zhang, Zhengfan ^a   Chandrasekhar, Venkat ^a   Ratner, Mark A ^a   Mirkin, Chad A ^a  

^a NORTHWESTERN UNIVERSITY   (United States)

^b UNIVERSITY OF WASHINGTON   (United States)

Author keywords

Dip pen nanolithography; DNA directed assembly; Electrical properties; Nanodevices; Nanoparticles

Indexed keywords

BIOCHEMISTRY; BIOSENSORS; DNA; ELECTRIC PROPERTIES; ELECTRODES; NANOSTRUCTURED MATERIALS; NETWORKS (CIRCUITS); SELF ASSEMBLY; THERMAL EFFECTS; TUNNEL JUNCTIONS;

DIP-PEN NANOLITHOGRAPHY; DNA-DIRECTED ASSEMBLY; NANODEVICES; NANOPARTICLES;

NANOTECHNOLOGY;

DNA; NANOMATERIAL; OLIGODEOXYRIBONUCLEOTIDE; PEPTIDE;

ARTICLE; CHEMISTRY; EQUIPMENT DESIGN; MICROELECTRODE; MICROFLUIDIC ANALYSIS; MICROFLUIDICS; NANOTECHNOLOGY; SEQUENCE ALIGNMENT; SURFACE PROPERTY;

DNA; EQUIPMENT DESIGN; MICROELECTRODES; MICROFLUIDIC ANALYTICAL TECHNIQUES; MICROFLUIDICS; NANOSTRUCTURES; NANOTECHNOLOGY; OLIGODEOXYRIBONUCLEOTIDES; PEPTIDES; SEQUENCE ALIGNMENT; SURFACE PROPERTIES;

EID: 24144477753     PISSN: 16136810     EISSN: 16136829     Source Type: Journal    
DOI: 10.1002/smll.200400005     Document Type: Review

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