Study of Ni3P growth due to solder reaction-assisted crystallization of electroless Ni-P metallization

Journal of Materials Science Letters

Volumn 19, Issue 19, 2000, Pages 1755-1757

  Hung, K C ^a   Chan, Y C ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; CRYSTAL GROWTH; ELECTROLESS PLATING; ENERGY DISPERSIVE SPECTROSCOPY; NICKEL COMPOUNDS; SCANNING ELECTRON MICROSCOPY; SOLDERING; X RAY DIFFRACTION;

ELECTROLESS METALLIZATION;

METALLIZING;

EID: 0034300165     PISSN: 02618028     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1006735103744     Document Type: Article

References (7)

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3. C. A. CHANG, ibid. 60(3) (1986) 1220.
4. W. RIEDEL, "Electroless Nickel Plating" (Finishing Publications Ltd., 1991).
5. J. W. JANG, P. G. KIM, K. N. TU, D. R. FREAR and P. THOMPSON, J. Appl. Phys. 85(12) (1999) 8456.
6. K. L. LIN and J. M. JANG, Mat. Chem. Phys. 38 (1994) 33.
7. H. LI, H. Y. CHEN, S. Z. DONG, J. S. YANG and J. F. DENG, Appl. Surf. Sci. 125 (1998) 115.