A wafer level encapsulated FBAR chip molded into a 2.0 mm×1.6 mm plastic package for use as a PCS full band Tx filter

Proceedings of the IEEE Ultrasonics Symposium

Volumn 2, Issue , 2003, Pages 1798-1801

  Feld, David ^a   Bradley, Paul ^a   Barfknecht, Andrew ^a   Ruby, Richard ^a  

^a AGILENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; GLOBAL POSITIONING SYSTEM; HERMETIC DEVICES; NATURAL FREQUENCIES; WAVE FILTERS; WIRELESS TELECOMMUNICATION SYSTEMS;

CONSUMER DEMANDS; HEADSET ELECTRONICS; TEMPERATURE COEFFICIENTS;

ACOUSTIC RESONATORS;

EID: 4143145634     PISSN: 10510117     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. P. Bradley, R.Ruby, A. Barfknecht, F. Geefay, C. Han, G. Gan, and Y. Oshymansky, "A 5 mm×5 mm×1.37 mm Hermetic FBAR Duplexer for PCS Handsets with Wafer-Scale Packaging," 2002 IEEE Ultrasonics Symposium, Oct. 2002.
2. K.Wang, M. Frank, P. Bradley, R. Ruby, W. Mueller, A. Barfknecht, and M. Gat, "FBAR Rx Filters for handset Front-End Modules with Wafer-Level Packaging", this Ultrasnoics Symposium
3. David Feld, Kun Wang, Paul Bradley, A. Barfknecht, B. Ly, R. Ruby, "A High Performance 3.0 mm ×3.0 mm×1.1 mm FBAR Full Band Filter for U.S. PCS Handsets", 2002 IEEE Ultrasonics Symposium, Oct. 2002.
4. R.C. Ruby, A. Barfknecht, C. Han, Y. Desai, F.Geefay, G.Gan, M. Gat, T. Verhoven, "High-Q FBAR Filters in a Wafer-Level, Chip-Scale Package", ISSCC Feb. 2000.
5. J. Larson III, P. Bradley, S. Wartenberg, R. Ruby, and Y. Oshmyansky, "Modified Butterworth-Van Dyke Circuit for FBAR Resonators and Automated Measurement System," paper 3H-5, presented at the IEEE International Ultrasonics Symposium in San Juan, Puerto Rico, Oct. 22-25, 2000.