Wafer-level-package for bulk acoustic wave (BAW) filters

IEEE MTT-S International Microwave Symposium Digest

Volumn 2, Issue , 2004, Pages 493-496

  Franosch, M ^a   Oppermann, K G ^a   Meckes, A ^a   Nessler, W ^a   Aigner, R ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

Bulk Acoustic Wave (BAW) devices; System in package (SIP); Wafer Level Package (WLP)

Indexed keywords

BULK ACOUSTIC WAVE (BAW) DEVICES; SURFACE-ACOUSTIC WAVES (SAW); SYSTEM-IN-PACKAGE (SIP); WAFER-LEVEL PACKAGE (WLP);

ACOUSTIC WAVES; CMOS INTEGRATED CIRCUITS; DIODES; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS; SURFACE TREATMENT; TRANSISTORS; ULTRAVIOLET RADIATION;

WAVE FILTERS;

EID: 4444222150     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. R. Ruby, A. Barfknecht, C. Han, Y. Desai, F. Geefay, G. Gan, M. Gat, T. Verhoeven, "High-Q FBAR Filters in a Wafer-Level, Chip-Scale Package", IEEE ISSCC 2002 conference, Feb. 2002
2. R. Aigner, J. Kaitila, J. Ellä, L. Elbrecht, W. Nessler, M. Handtmann, T. Herzog, and S. Marksleiner, "Bulk-Acoustic-Wave Filters: Performance Optimization and Volume Manufacturing", IEEE International Microwave Symposium IMS MTT-S, Philadelphia, June 2003
3. R. Aigner, F. Dacche, G. Ehrler, A. Meckes, H.-J. Timme, M. Weber, "Low Profile Packaging Solution for RF-MEMS Suitable for Mass Production", Proceedings of IMAPS Conference, Boston, Nov 2003
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6. www.infineon.com/BAW