Overview and development trends in the field of MEMS packaging

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2001, Pages 1-5

  Reichl, H ^a   Grosser, V ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ACTUATORS; CHIP SCALE PACKAGES; INTEGRATED CIRCUITS; MICROELECTRONIC PROCESSING; SENSORS;

WAFER LEVEL PACKAGING (WLP);

MICROELECTROMECHANICAL DEVICES;

EID: 0035010960     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)