A wafer-level microcap array to enable high-yield microsystem packaging

IEEE Transactions on Advanced Packaging

Volumn 27, Issue 3, 2004, Pages 490-496

  Chiang, Yuh Min Johnson ^a   Bachman, Mark ^b   Li, G P ^b  

^a Applied MEMS Inc   (United States)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMATION; ELECTRONIC EQUIPMENT TESTING; MICROACTUATORS; MICROELECTROMECHANICAL DEVICES; MICROSENSORS; MOLDING; OPTOELECTRONIC DEVICES; RAPID PROTOTYPING;

MICROMACHINED DEVICES; MICROOPTICALELECTROMECHANICAL SYSTEMS (MOEMS); MICROSYSTEM PACKAGING; PACKAGE ASSEMBLY; WAFER LEVEL MICROCAP ARRAY; WAFER LEVEL PACKAGING;

ELECTRONICS PACKAGING;

EID: 7244226133     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2004.831825     Document Type: Article

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