FBAR Rx filters for handset front-end modules with wafer-level packaging

Proceedings of the IEEE Ultrasonics Symposium

Volumn 1, Issue , 2003, Pages 162-165

  Wang, Kun ^a   Frank, Michael ^a   Bradley, Paul ^a   Ruby, Richard ^a   Mueller, William ^a   Barfknecht, Andrew ^a   Gat, Moshe ^a  

^a AGILENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC SURFACE WAVE DEVICES; ATTENUATION; CAPACITORS; HERMETIC DEVICES; PACKAGING; RESISTORS; RESONATORS; TELEPHONE SETS; TOPOLOGY;

FILM BULK ACOUSTIC RESONATORS (FBAR); FRONT-END MODULES (FEMS); MINIATUARIZATION; WAFER-LEVEL PACKAGING;

WAVE FILTERS;

EID: 4143077158     PISSN: 10510117     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. R. C. Ruby, P. Bradley, Y. Oshmyansky, A. Chien, J. D. Larson III, "Thin film bulk acoustic resonators (FBAR) for wireless applications", IEEE Ultrasonic Symposium, 2001, pg. 813-821.
2. K. M. Lakin, "Thin film resonators and filters", 1999 IEEE Ultrasonic Symposium, pp. 895-906.
3. R. Ruby, A. Barfknecht, C. Han, Y. Desai, F. Geefay, G. Gan, M. Gat, T. Verhoeven, "High-Q FBAR Filters in a Wafer-level, Chip-Scale Package", Proceeding of ISSCC 2002, Feb. 2002.
4. J. Heighway, S.N. Kondratiev, V. P. Plessky, "Balanced Bridge SAW Impedance Element Filters", 1994 IEEE Ultrasonic Symposium, pp.27-30.
5. J. D. Larson III, P. Bradley, S. Wartenberg, R. Ruby, "Modified Butterworth-Van Dyke circuit for FBAR resonators and automated measurement system", 2000 IEEE Ultrasonic Symposium, pp. 863-868.
6. Agilent Technologies, Inc., Application Note 1373-2, "Concepts in Balanced Device Measurement".