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Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 20, Issue 6, 2002, Pages 2295-2298

Investigations of pulse current electrodeposition for damascene copper metals

(4) Chang, Shih Chieh a Shieh, Jia Min b Dai, Bau Tong b Feng, Ming Shiann a

a NATIONAL CHIAO TUNG UNIVERSITY (Taiwan)

b NATIONAL NANO DEVICE LABORATORIES (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT DENSITY; ELECTRIC CONDUCTIVITY; ELECTRODEPOSITION; ELECTROLYTES; GRAIN SIZE AND SHAPE; MATHEMATICAL MODELS; MORPHOLOGY; OPTIMIZATION; RAPID THERMAL ANNEALING; SCANNING ELECTRON MICROSCOPY;

DAMASCENE COPPER METALS; PULSE CURRENT ELECTRODEPOSITION;

COPPER;

EID: 0036874414 PISSN: 0734211X EISSN: None Source Type: Journal
DOI: 10.1116/1.1518974 Document Type: Article

Times cited : (17)

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