The strength of surface micromachined indium phosphide devices evaluated by Weibull analysis of tensile and bending tests

Sensors and Materials

Volumn 11, Issue 4, 1999, Pages 247-256

  Greek, Staffan ^a   Seassal, Christian ^b   Viktorovitch, Pierre ^b   Hjort, Klas ^a  

^a UPPSALA UNIVERSITY   (Sweden)

^b INSTITUT DES NANOTECHNOLOGIES DE LYON   (France)

Author keywords

Bending strength; Indium phosphide; Reactive ion etch; Tensile strength; Weibull statistics

Indexed keywords

EID: 0033474177     PISSN: 09144935     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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