Modelling microstructure development in trench-interconnect structures

Proceedings of the IEEE 1998 International Interconnect Technology Conference, IITC 1998

Volumn 1998-June, Issue , 1998, Pages 247-249

  Sanchez, J ^a   Besser, P R ^b  

^a UNIVERSITY OF MICHIGAN   (United States)

^b ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

GRAIN GROWTH; INTEGRATED CIRCUIT INTERCONNECTS; INTERFACIAL ENERGY; MICROSTRUCTURE;

CRYSTALLOGRAPHIC ORIENTATIONS; CRYSTALLOGRAPHIC TEXTURES; HIGH ASPECT RATIO TRENCHES; INTERCONNECT STRUCTURES; MICRO-STRUCTURE EVOLUTIONS; MICROSTRUCTURE DEVELOPMENT; SURFACE AND INTERFACIAL ENERGY; TRENCH ASPECT RATIOS;

ASPECT RATIO;

EID: 17144402365     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.1998.704912     Document Type: Conference Paper

References (8)

1. M. J. Attardo, R. Rosenberg, J. Applied Physics, Vol. 41, NO. 6, 1970, pp. 382-389.
2. S. Vaidya, A. K. Sinha, Thin Solid Films, Vol. 75, 1981, pp. 253-259.
3. C. V. Thompson, J. Applied Physics, Vol. 58, No. 2, 1985, pp. 763-772.
4. J. Sanchez, Jr., E. Arzt, Scripta Metal., Vol. 27, 1992, pp. 285-290.
5. E.M. Zielinski, Ph.D, Thesis, Stanford University, 1995
6. M. MacLean, B. Gale, Phil. Ma,g., Vol. 20, No. 167, 1969, pp. 1033-1041.
7. S. M. Foiles, Phys. Rev. B., Vol. 33, No. 12, 1986, pp. 7983-7991.
8. P. R. Besser J. Sanchez Jr., D. Field, Adv. Metallizations, 1996, MRS, Vol, ULSI[ XII, 1996, pp. 89-95