Reaction diffusion and formation of Cu11In9 and In27Ni10 phases in the couple of indium-substrates

Materials Transactions

Volumn 44, Issue 1, 2003, Pages 72-77

  Kim, Dae Gon ^a   Yoon, Jeong Won ^a   Lee, Chang Youl ^a   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

Activation energy; Indium solder; Interfacial reaction; Intermetallic compound; Reaction diffusion

Indexed keywords

ACTIVATION ENERGY; COPPER COMPOUNDS; DIFFUSION IN SOLIDS; GROWTH (MATERIALS); INDIUM COMPOUNDS; SCANNING ELECTRON MICROSCOPY; SOLDERING ALLOYS; SUBSTRATES; THERMAL EFFECTS; X RAY DIFFRACTION ANALYSIS;

COPPER INDIUM; INDIUM NICKEL; REACTION DIFFUSION; VOLUME DIFFUSION;

INTERMETALLICS;

EID: 0037227637     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.44.72     Document Type: Article

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