Challenges in interconnection and packaging of microelectromechanical systems (MEMS)

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 666-675

  Ramesham, Rajeshuni ^a   Ghaffarian, Reza ^a  

^a CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC EQUIPMENT TESTING; ELECTRONICS PACKAGING; QUALITY ASSURANCE; RELIABILITY;

INTERCONNECTION; MICROELECTROMECHANICAL SYSTEMS; MICROELECTROMECHANICAL SYSTEMS CHIP PACKAGING; WAFER LEVEL PROCESSES;

MICROELECTROMECHANICAL DEVICES;

EID: 0034476043     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (70)