Sealing of micromachined cavities using chemical vapor deposition methods: characterization and optimization

Journal of Microelectromechanical Systems

Volumn 8, Issue 2, 1999, Pages 135-145

  Liu, Chang ^a   Tai, Yu Chong ^b  

^a UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

^b California Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; CRYSTAL MICROSTRUCTURE; GLASS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SEALING (FINISHING); SILICON; SILICON NITRIDE;

MICROMACHINED CAVITIES; PHOSPHOSILICATE GLASS; POLYCRYSTALLINE SILICON;

MICROELECTROMECHANICAL DEVICES;

EID: 0033149765     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/84.767109     Document Type: Article

References (22)

1. L. Lin, K. M. McNair, R. T. Howe, and A. P. Pisano, "Vacuum encapsulated lateral micro-resonators," in Dig. Tech. Papers, 7th Int. Conf. Solid State Sensors and Actuators, Transducer'93, Yokohama, Japan, 1993, p. 270.
2. J. Liu, Y. C. Tai, K. C. Pong, Y. Zohar, and C. M. Ho, "Micromachined channel/pressure sensor systems for micro flow studies," in Dig. Tech. Papers, 7th Int. Conf. Solid State Sensors and Actuators, Transducer'93, Yokohama, Japan, 1993, p. 995.
3. C. Liu, Y. C. Tai, J. B. Huang, and C. M. Ho, "Surface thermal micromachined shear-stress sensors," in Proc., Symp. Application of Microfabrication to Fluid Mechanics, 1994 Int. Mechanical Engineering Congress and Exposition, Chicago, IL, USA, 1994, pp. 9-15.
4. H. Guckel, "Surface micromachined pressure transducers," Sens. Actuators, vol. A, no. 28, pp. 133-146, 1991.
5. H. Guckel, C. Rypstat, M. Nesnidal, J. D. Zook, D. W. Burns, and D. K. Arch, "Polysilicon resonant microbeam technology for high performance sensor applications," in Tech. Dig., Solid-State Sensor and Actuator Workshop, Hilton Head Island, SC, 1992, p. 153.
6. K. H.-L. Chau, C. D. Fung, P. R. Harris, and J. G. Panagou, "High-stress and overrange behavior of sealed-cavity polysilicon pressure sensors," in Tech. Dig., Solid-State Sensor and Actuator Workshop, Hilton Head, SC, 1990, p. 181.
7. K. Shimaoka, "Micro pressure sensor," in Tech. Dig. 9th Sensor Symp., 1990, pp. 47-50.
8. R. Legtenberg and H. A. C. Tilmans, "Electrostatically driven vacuum-encapsulated polysilicon resonators, I. Design and fabrication," Sens. Actuators, vol. A 45, no. 1, pp. 57-66, Oct. 1994.
9. Q. Mei, T. Tamagawa, C. Ye, Y. Lin, S. Zurn, and D. L. Polla, "Planar-processed tungsten and polysilicon vacuum microelectronic devices with integral cavity sealing," J. Vacuum Sci. Technol., vol. B11, no. 2, p. 493, 1993.
10. H. Busta, "Review: Vacuum electronics," J. Micromech. Microeng., vol. 2, pp. 43-74, 1992.
11. S. Zurn, Q. Mei, C. Ye, T. Tamagawa, and D. L. Polla, "Sealed vacuum electronic devices by surface micromachining," in Proc. Int. Electronics Device Meetings (IEDM)'91, Washington, DC, 1991, pp. 205-208.
12. M. Bartek, J. A. Foerster, and R. F. Wolffenbuttel, "Vacuum sealing of microcavities using metal evaporation," Sens. Actuators, vol. A61, nos. 1-3, pp. 364-368, June 1997.
13. M. Esashi, N. Ura, and Y. Matsumoto, "Anodic bonding for integrated capacitive sensors," in Proc. IEEE Workshop on Micro Electro-Mechanical Systems, MEMS'92, Travemunde, Germany, 1992, pp. 43-48.
14. H. Henmi, S. Shoji, Y. Shoji, K. Yosimi, and M. Esashi, "Vacuum packaging for microsensors by glass-silicon anodic bonding," in Dig. Tech. Papers, 7th Int. Conf. Solid State Sensors and Actuators, Transducer'93, Yokohama, Japan, 1993, p. 584.
15. L. Parameswaran, V. M. McNeil, M. A. Huff, and M. A. Schmidt, "Sealed-cavity microstructure using wafer bonding technology," in Dig. Tech. Papers, 7th Int. Conf. Solid State Sensors and Actuators, Transducer'93, Japan, p. 274, 1993.
16. W. Ko, Q. Wang, and Q. H. Wu, "Long term stable capacitive pressure sensor for medical implant," in Dig. Tech. Papers, 7th Int. Conf. Solid State Sensors and Actuators, Transducer'93, Japan, p. 592, 1993.
17. M. M. IslamRaja, M. A. Cappelli, J. P. McVittie, and K. C. Saraswat, "A three-dimensional model for low-pressure chemical vapor deposition step coverage in trenches and circular vias," J. Appl. Phys., vol. 70, no. 11, pp. 7137-7140, 1991.
18. J. Liu, Y. C. Tai, J. Lee, K. C. Pong, Y. Zohar, and C. M. Ho, "In Situ monitoring and universal modeling of sacrificial PSG etching using hydrofluoric acid," in Proc. IEEE Workshop on Micro Electro Mechanical Systems, MEMS'93, Fort Lauderdale, FL, 1993, p. 71.
19. 2 films by LPCVD," J. Electrochem. Soc., vol. 137, no. 4, p. 1222, 1990.
20. L. Y. Cheng, J. P. McVittie, and K. C. Saraswat, "New test structure to identify step coverage mechanisms in chemical vapor deposition of silicon dioxide," Appl. Phys. Lett., vol. 58, no. 19, 1991.
21. J. J. Hsieh, "Influence of surface-activated reaction kinetics on low pressure chemical vapor deposition conformality over micro features," J. Vac. Sci. Technol., vol. A11, no. 1, p. 78, 1993.
22. L. Lin, R. T. Howe, and A. P. Pisano, "Microelectromechanical filters for signal processing," IEEE J. Microelectromech. Syst., vol. 7, pp. 285-294, Sept. 1998.