Evaluation of thermal enhancements to flip-chip-plastic ball grid array packages

Journal of Electronic Packaging

Volumn 126, Issue 4, 2004, Pages 449-456

  Ramakrishna, K ^a   Lee, T Y Tom ^a  

^a FREESCALE SEMICONDUCTOR INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ARRAYS; COMPUTATIONAL FLUID DYNAMICS; ELECTRONIC EQUIPMENT; ENERGY DISSIPATION; FLIP CHIP DEVICES; FORCED CONVECTION; HEAT RESISTANCE; HEAT SINKS; HEAT TRANSFER; THERMAL CONDUCTIVITY; WIND TUNNELS;

MICROCHANNEL HEAT SINKS; PHYSICAL DESIGN; THERMAL BALLS; THERMAL ENHANCEMENT;

ELECTRONICS PACKAGING;

EID: 13944274254     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1827260     Document Type: Review

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