Thermal sub-modeling of high density interconnect substrates

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 2002, Pages 618-625

  De Oca, Tony Montes ^a   Joiner, Bennett ^a   Johnson, Zane ^a  

^a MOTOROLA INC   (United States)

Author keywords

Ball grid array; Electronic packaging; Finite element simulation; Flip chip; Thermal characterization; Thermal modeling; Thermal resistance; Theta; Theta JA

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; GLASS FIBERS; HEAT CONVECTION; HEAT RESISTANCE; INDUCTANCE; INTEGRATED CIRCUITS; PULSE WIDTH MODULATION; SUBSTRATES; THERMAL CONDUCTIVITY OF SOLIDS;

HIGH-DENSITY INTERCONNECTS (HDI);

CHIP SCALE PACKAGES;

EID: 0036455578     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

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