Enhancement of multichip modules (MCMs) cooling by incorporating micro-heat pipes and other high thermal conductivity materials into microchannel heat sinks

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 45-50

  Marongiu, M J ^a   Kusha, B ^b   Fallon, G S ^b   Watwe, A A ^c  

^a MJM Engineering Co   (United States)

^b Fluent Inc   (United States)

^c INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPILLARY FLOW; COMPUTATIONAL FLUID DYNAMICS; FINS (HEAT EXCHANGE); HEAT PIPES; HEAT TRANSFER; MICROCHANNELS; MICROPROCESSOR CHIPS; MULTICHIP MODULES; NETWORK COMPONENTS; THERMAL CONDUCTIVITY OF LIQUIDS; COMPUTER SIMULATION; FINITE ELEMENT METHOD; HEAT LOSSES; HEAT SINKS; THERMAL CONDUCTIVITY OF SOLIDS;

EFFECTIVE REMOVALS; FIN MATERIALS; HEAT DISSIPATION CAPABILITY; HEAT TRANSFER RATE; HIGH THERMAL CONDUCTIVITY; MICRO CHANNEL HEAT SINKS; MICRO HEAT PIPE; PUMPING POWER;

THERMAL MANAGEMENT (ELECTRONICS); ELECTRONICS PACKAGING;

SOFTWARE PACKAGE ICEPAK;

EID: 0031638632     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678670     Document Type: Conference Paper

References (10)

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