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Volumn , Issue , 1998, Pages 177-221
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Bibliography of air cooled heat sinks for thermal enhancement of electronic packages
a
a
IBM
(United States)
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Author keywords
[No Author keywords available]
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Indexed keywords
ADHESIVES;
BONDING;
HEAT SINKS;
THERMAL ENHANCEMENTS;
ELECTRONICS PACKAGING;
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EID: 0031651426
PISSN: 10652221
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (9)
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References (847)
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