Thermal performance comparison of high pin count cavity-up Enhanced Plastic Ball Grid Array (EPBGA) packages

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 19, Issue 2, 1996, Pages 427-443

  Mertol, Atila ^a,b  

^a IEEE

^b AGERE SYSTEMS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; HEAT TRANSFER; PERFORMANCE; PRINTED CIRCUIT BOARDS; THERMAL VARIABLES MEASUREMENT; THERMODYNAMIC PROPERTIES; WELDS;

FINITE ELEMENT SIMULATION CODE; JUNCTION TO AMBIENT RESISTANCE; JUNCTION TO CASE RESISTANCE; PLASTIC BALL GRID ARRAY PACKAGES; SOLDER BALL COUNTS; THERMAL PERFORMANCE;

SURFACE MOUNT TECHNOLOGY;

EID: 0030145354     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.496048     Document Type: Review

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