Optimization of high pin count cavity-up Enhanced Plastic Ball Grid Array (EPBGA) packages for robust design

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 20, Issue 4, 1997, Pages 376-388

  Mertol, Atila ^a,b  

^a IEEE   (United States)

^b AGERE SYSTEMS   (United States)

Author keywords

Design of experiment; Electronic package design optimization; Enhanced plastic ball grid array (EPBGA); Finite element model; Package warpage; Plastic ball grid array (PBGA); Solder ball strain distribution; Stress analysis; Taguchi analysis

Indexed keywords

APPROXIMATION THEORY; COMPUTER SIMULATION; ENCAPSULATION; FINITE ELEMENT METHOD; OPTIMIZATION; PRINTED CIRCUIT BOARDS; RELIABILITY; SOLDERING; STATISTICAL METHODS; STRAIN; STRESS ANALYSIS; SUBSTRATES;

ENHANCED PLASTIC BALL GRID ARRAY (EPBGA); PACKAGE WARPAGE; SOLDER BALL STRAIN DISTRIBUTION; TAGUCHI ANALYSIS;

ELECTRONICS PACKAGING;

EID: 0031272782     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.641505     Document Type: Article

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