Thermal enhancements for a plastic-ball-grid array interconnect technology: Computational fluids dynamics modeling and characterization for low-velocity air-cooling

Thermal Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 1996, Pages 166-173

  Kromann, Gary B ^a   Argento, Christopher W ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; HEAT SINKS; HEAT TRANSFER; PRINTED CIRCUIT DESIGN; THERMAL CONDUCTIVITY OF SOLIDS;

PACKAGE SUBSTRATE CONDUCTIVITY; PLASTIC BALL GRID ARRAY (PBGA) PACKAGES; THERMAL MANAGEMENT;

ELECTRONICS PACKAGING;

EID: 0029698945     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (19)