PBGA for high power: extending the thermal envelope

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1996, Pages 713-718

  Mulgaonker, S ^a   Hawkins, G ^a   Ramakrishna, K ^a   Mawer, A ^a   Winkler, E ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COMPUTER WORKSTATIONS; ELECTRIC RESISTANCE; FINITE ELEMENT METHOD; HEAT SINKS; OPTIMIZATION; THERMAL CYCLING; ULSI CIRCUITS;

HEAT FLOW; PLASTIC BALL GRID ARRAY; THERMAL VIAS;

ELECTRONICS PACKAGING;

EID: 0029717740     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (4)