Thermal performance of an air-cooled plastic ball grid array package in natural and forced convection

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 1998, Pages 27-34

  Ramakrishna, K ^a   Thomas, T R ^a   Tom Lee, T Y ^a   Trent, J R ^a   Hause, J V ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; FLIP CHIP DEVICES; FORCED CONVECTION; NATURAL CONVECTION; PRINTED CIRCUIT BOARDS; TEMPERATURE MEASUREMENT;

LINEAR SUPERPOSITION METHOD; PLASTIC BALL GRID ARRAY PACKAGES; THERMAL PERFORMANCE;

ELECTRONICS PACKAGING;

EID: 0031620446     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (18)